TM-TUR-C256 Uncooled Infrared Module
The Turing C256 uncooled infrared module, featuring an advanced 256×192 wafer detector, boasts compact dimensions, a lightweight design, and low power consumption, aligning with SWaP³ (Size, Weight, Power, and Performance) design requirements. Its split assembly enhances flexibility, while multiple auxiliary development tools enable seamless integration with various ARM architecture SOC platforms. The module supports simultaneous output of images and temperature values, offering a range of lightweight infrared lenses and extension components. This cost-effective solution is ideal for applications in industries such as power, security, industrial automation, and machine vision.
Feature
Low-Cost Solution
It adopts the 256×192 WLP detector and weighs only 3.5g with a 3.2mm lens.
It supports multiple ARM architecture SOC platforms, capable of directly processing sensor data.
Easy Development
It is compatible with various mainstream embedded SOC platforms and can optimize the image effect of ISP.
It provides multiple SDK development interfaces for rapid secondary development.
Multiple Selections
The FOV varies from 20° to 90° and the extension supports multiple protocols such as DVP, MIPI, and analog video.
The split design is convenient for integration and development, supporting applications in multiple areas such as consumer, intelligence, security, and industrial sectors.
Specification
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Application Scenarios
