infrared module

The Turing C256 uncooled infrared module, featuring an advanced 256×192 wafer detector, boasts compact dimensions, a lightweight design, and low power consumption, aligning with SWaP³ (Size, Weight, Power, and Performance) design requirements. Its split assembly enhances flexibility, while multiple auxiliary development tools enable seamless integration with various ARM architecture SOC platforms. The module supports simultaneous output of images and temperature values, offering a range of lightweight infrared lenses and extension components. This cost-effective solution is ideal for applications in industries such as power, security, industrial automation, and machine vision.

The TM-TUR-F384 uncooled infrared module is equipped with a high-sensitivity VOx infrared detector, delivering exceptional performance through advanced image processing and high-accuracy temperature measurement algorithms. This robust and versatile module is designed for a wide range of applications, including security monitoring, industrial temperature measurement, forest fire prevention, and rail transportation. Its high-performance kernel ensures consistent reliability, making it an ideal choice for scenarios that demand precise thermal imaging and temperature detection across various industries.