TM-TUR-L256 Uncooled Infrared Module (Imaging)
The TM-TUR-L256 uncooled infrared module features a cutting-edge 256×192 wafer detector housed in a compact 18×18mm design. Its integrated architecture sets new benchmarks for weight, dimensions, and power consumption (SWaP³) in the OEM module industry, delivering exceptional miniaturized solutions for consumer products.
Feature
Compatibility Design
Its resolution is 256×192 and dimension is 18mm×18mm, which are consistent with those of the L384 mechanical interface for compatibility design.
Excellent Performance
50Hz imaging to provide a smooth image experience.
Multiple Selections
The FOV is 20°~90° and the extension supports multiple interfaces such as DVP/USB/Analog video.
Specification
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Application Scenarios
